1. Client Introduction

Client Name: A well-known public research university in the United States Industry: Higher Education, Advanced Materials & Semiconductor ResearchkLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
Core Needs: Low-temperature plasma thin film deposition equipment with full vacuum and multi-gas precise control to support frontier research on 2D materials, dielectric films and microelectronic deviceskLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac

This university owns a top-tier Department of Materials Science and Engineering, running long-term research on nanocoatings, photovoltaic passivation films and flexible electronic substrates. Traditional thermal CVD requires high processing temperature, which will deform or damage temperature-sensitive substrates such as polymer and glass wafers. Existing small lab coating equipment suffers from unstable plasma, poor film uniformity and lack of standardized data recording functions. The research team intended to build a complete thin film deposition platform with North American safety certification, to replace scattered experimental devices and improve experimental repeatability for academic paper output.kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
2. Equipment IntroductionkLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac

Equipment Name: Horizontal Tubular PECVD System kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
Operating Temperature: Room temperature ~ 400℃kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
Temperature Control Accuracy: ±1℃kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
Furnace Tube Material: High-purity transparent quartz tube (customizable diameter)kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
RF Plasma Module: 13.56 MHz RF power source, output range 0–300W, stable glow discharge without arcingkLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
Vacuum System: Rotary vane pump + molecular pump unit, ultimate vacuum up to 4×10⁻⁴ PakLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
Gas Supply System: Multi-channel high-precision MFC, compatible with SiH₄, NH₃, N₂O, Ar, H₂ and other process gases; each pipeline equipped with anti-backflow valves and pressure sensorskLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
Control System: PLC + English touchscreen, supports 30-segment automatic heating-holding-cooling programs; real-time storage and export of temperature, vacuum, gas flow and RF power curveskLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
Safety Configuration: Over-temperature interlock, vacuum anomaly alarm, gas leakage monitoring, emergency stop button, pressure relief exhaust device, fully compliant with US laboratory safety specificationskLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac

This integrated PECVD system is specially developed for university thin film research labs. It adopts an all-in-one mobile cabinet layout integrating heating, vacuum, gas circuit and control modules. The low-temperature plasma activation technology avoids high-temperature substrate damage, while independent multi-zone temperature adjustment and uniform plasma distribution guarantee consistent film thickness across substrates. The transparent quartz tube allows real-time visual observation of plasma state and film growth process during experiments.kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
 kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac

kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac

3. Equipment Application

Specific Process: Low-Temperature Plasma Enhanced Chemical Vapor Deposition of Advanced Thin Films Whole Process Flow: Chamber evacuation → Heating to set temperature → Stabilize gas flow → RF plasma ignition → Constant deposition → Purge chamber → Controlled coolingkLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac

In the university’s thin film laboratory, this PECVD system is mainly applied to the following research materials:kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac

1. Silicon nitride (SiNₓ) & silicon oxide (SiO₂) dielectric passivation films for solar cell and semiconductor chips
2. Amorphous silicon and microcrystalline silicon thin films for optoelectronic device research
3. 2D material precursor deposition (graphene, h-BN) under mixed hydrogen-argon atmosphere
4. Alumina passivation coatings for flexible glass and polymer substrates

Core Experimental Improvements Brought by This Equipment:kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac

• Film thickness deviation controlled within ±2% on 4-inch substrate, far better than old thermal CVD equipment
• Processing temperature lowered below 400℃, realizing complete deposition on heat-labile flexible substrates
• Stable plasma environment reduces film pinhole and crack defects by over 75%
• Automatic data recording eliminates manual recording errors, greatly improving data reproducibility for academic research

4. Customer Feedback

"After comparing multiple international equipment suppliers, we finally chose PROTECH’s customized tubular PECVD system for our new thin film lab. The integrated mobile cabinet design saves much limited lab space, and the full English operation interface is very friendly for our graduate students and researchers. The RF plasma remains stable during long-term continuous deposition experiments, temperature uniformity and vacuum sealing performance fully meet our research standards. The equipment arrived intact after ocean freight, and remote video commissioning helped our team complete startup and parameter debugging quickly without overseas engineer arrival. We have completed batches of SiNₓ passivation film and 2D material growth experiments with consistent and reliable test data. The complete safety interlock system also makes our lab management much easier. We will prioritize PROTECH when expanding our thin film pilot platform in the future."kLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac
— Materials Science Research Group, A Public Research University in the United StateskLWMuffle Furnace,Tube Furnace,Vacuum Furnace,Atmosphere Furnac